1～3 item / All 3 items
The productivity is different from previous exposure devices!
The usual tact time of 12 seconds has been reduced to an incredible 9 seconds! When converted to a minute, this allows for an increase in production of 1 to 2 more units compared to before.
A roll-to-roll simultaneous exposure device that contributes to reducing running costs!
The "BEX-560DR-LED" is a roll double-sided simultaneous exposure device that can meet the diverse needs of various production sites with high productivity, high precision, large area, energy efficiency, and expandability, all in one unit. Equipped with a high-quality LED light source unit, it reduces the burden of running costs. Additionally, it achieves a positioning accuracy of 1μm for pattern alignment on both sides through an ultra-high precision alignment mechanism. 【Features】 ■ Increases the cleanliness of the exposure chamber / Classifies the cleanliness within the device ■ Reduces the burden of running costs: High-quality LED light source unit - Long-life LED that does not require lamp replacement - Fly-eye lens designed specifically for LEDs - Low power consumption of 1/8 compared to mercury lamps - Equipped with a high-speed electronic shutter - LED light source (365nm) that does not include infrared rays *For more details, please download the PDF or feel free to contact us.
This is a device that allows simultaneous exposure of the front and back surfaces of wafers using a belt conveyor method. It can be set to fast exposure mode or alignment exposure mode.
This product is a semi-automatic double-sided simultaneous exposure device. The removal and loading from the wafer carrier is done using a belt system. The mask and wafer come into contact and are exposed simultaneously. There are two exposure modes selectable via recipes: a fast exposure mode without alignment and an alignment exposure mode where the alignment of the wafer and mask is performed manually. Utilizing the features of the belt transport system, the fast exposure mode allows for high throughput processing. The alignment of the upper and lower masks, as well as the mask-wafer alignment, is done with the same I.F., ensuring that operations do not become complicated. Additionally, changing the mask is also easy. Since we handle everything from design to manufacturing and sales in-house, we have achieved low prices. 【Features】 ■ Simultaneous double-sided exposure ■ Fast exposure mode, alignment exposure mode ■ Easy setup change, compatible with multiple substrate sizes ■ Space-saving & easy maintenance ■ Achieves low cost and compact design, suitable for small-batch production of various types ■ Belt transport system *For more details, please refer to the PDF document or feel free to contact us.
